Huawei AIU03-100C AC Input Unit Power Module (200-240V/346-415V 100A Busbar Blind-Mate)
The Huawei AIU03-100C (02312MUD) is a carrier-grade AC Input Unit power distribution module featuring 100A max current and blind-mate busbar design.
HuaweiModel: CT016M501
Huawei CT016M501 Power Subrack Backplane Busbar Adapter Module (High-Current Blind-Mate)
The CT016M501 is a critical hardware component in Huawei indoor telecom power systems, integrating subrack backplane signal routing, high-current busbar power distribution, and low-voltage trip protection.
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- Rated Busbar Current
- High-Current Busbar Integration
- Interface Mating Type
- Gold-Finger Blind-Mate
- Core Protection Function
- High-Current Low-Voltage Trip
- Applicable Power System
- Huawei Indoor Telecom Subrack
- PCB Manufacturing Craft
- Multi-Layer Immersion Gold Flame-Retardant Backplane
- Maintenance & Expansion Feature
- Hot-Swap & Rapid Expansion Support
What this product is
What this product is
Serving as the neural hub and power junction within the telecom subrack, this module densely integrates backplane interface conversion circuitry with high-purity copper busbars, providing stable electrical and mechanical support for rectifier modules and control units.
What problem it solves
Effectively resolves issues in traditional telecom subracks such as complex internal wiring, high thermal losses in high-current transmission, mechanical wear from frequent hot-swapping, and delayed system-level low-voltage disconnect during deep battery discharge.
Who and where it is for
Widely applicable for capacity expansion and baseline hardware maintenance of Huawei outdoor cabinets and indoor telecom embedded power systems (such as 30A/50A/100A power subsystems).
Core advantages
- Precision Gold-Finger Blind-Mate: Supports high-frequency hot-swapping for rectifiers and controllers with minimal contact resistance and anti-vibration wear resistance.
- Lossless High-Current Busbar: Integrated thick copper busbar design effectively minimizes temperature rise and ohmic losses during parallel high-current transmission.
- Intelligent Low-Voltage Trip Integration: Built-in precision low-voltage monitoring hardware trigger chain ensures fast and secure system cutoff during critical battery over-discharge.
- Carrier-Grade High-Reliability Backplane: Multi-layer PCB immersion gold manufacturing offers superior UL flame retardancy and exceptional electromagnetic interference (EMI) protection.
Technical specifications
| Key specifications | Value |
|---|---|
| Rated Busbar Current | High-Current Busbar Integration |
| Interface Mating Type | Gold-Finger Blind-Mate |
| Core Protection Function | High-Current Low-Voltage Trip |
| Applicable Power System | Huawei Indoor Telecom Subrack |
| PCB Manufacturing Craft | Multi-Layer Immersion Gold Flame-Retardant Backplane |
| Maintenance & Expansion Feature | Hot-Swap & Rapid Expansion Support |
| Overall System Efficiency | Up to 96.2% (Gold Standard) |
| Acoustic Noise | ≤ 55 dBA (at 25°C ambient load) |
| Ingress Protection Rating | IP20 (Indoor Dust & Finger Proof) |
| Dielectric Withstand Voltage | 3000VAC Input to Ground (< 5mA) |
Applications
01
Telecom 4G/5G macro cellular base stations and distributed remote power sites
02
Enterprise-grade cloud data center mission-critical -48V DC power distribution lineups
03
Utility power grid dispatch centers and high-voltage substation DC switchgear rooms
04
Railway transit signaling, automated train control, and communications equipment rooms
Frequently asked questions
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